摘要 |
PROBLEM TO BE SOLVED: To provide a Peltier module in which the heat absorbing face and the heat radiating face of a thermoelectric element part are prevented from being connected thermally through a metal having a high thermal conductivity covering a resin film in order to eliminate a problem of cooling performance being deteriorated due to leak of heat through the heat absorbing face and the heat radiating face. SOLUTION: A spacer 11 having thermal insulation properties is disposed around a thermoelectric element 5, and a resin film 9 on the heat absorbing face side is bonded to a resin film 9 on the heat radiating face side through the space 11, thus forming a sealing bag 10. Inner pressure of the sealing bag 10 is reduced without touching the resin film 9 on the heat absorbing face side and the resin film 9 on the heat radiating face side.
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