Semiconductor chip, semiconductor device, methods of fabricating thereof, circuit board and electronic device

摘要

The positions of first terminals of a first semiconductor chip have a plane symmetrical relationship with the positions of second terminals of a second semiconductor chip. First buffer circuits of the first semiconductor chip are identical with second buffer circuits of the second semiconductor chip at least in design. First and second internal circuits are identical with each other at least in design. The first and second semiconductor chips have different interconnecting lines.