| 摘要 |
PROBLEM TO BE SOLVED: To shorten the time required for manufacturing a semiconductor inspecting jig and reduce the manufacturing cost by utilizing the existing semiconductor inspecting jig even when the type or crust body of a semiconductor is changed. SOLUTION: This semiconductor inspecting jig is provided with a semiconductor inspecting board 3, an IC socket 1 having upper contact sections 4 electrically connected to the contacts 12 of the semiconductor 11 and lower contact sections 5 electrically connected to the upper contact sections 4 via a conductor and electrically connected to pads 7 on the semiconductor inspecting substrate, and a printed conductive sheet 2 which is a sheet formed with a conductive pattern 6. No cable wiring is required for the connection between the IC socket 1 and the semiconductor inspecting board 3, the time for manufacturing the semiconductor inspecting jig is sharply shortened, and the manufacturing cost can be reduced.
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