| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing apparatus and a polishing method capable of increasing polishing speed. SOLUTION: The polishing apparatus comprises a polishing pad 2 rotated by a surface plate rotary shaft 3, a pipe 4 for slurry for supplying slurry 5 on an upper face of the polishing pad 2, a substrate holding mechanism 6 for holding a substrate 7, a substrate rotating shaft 8 for rotating the substrate holding mechanism 6 about a substrate axial center B, and a rotating mechanism 9 for rotating the substrate axial center B about an eccentric axial center C. The angular velocity when the substrate axial center B rotates about the eccentric axial center C is greater than the angular velocity when the substrate holding mechanism 6 rotates about the substrate axial center B. Since the contact area of a minute region of the substrate 7 and the polishing pad 2 becomes larger, the partial abrasion of abrasive grains on the polishing pad 2 and the loading of the polishing pad 2 are prevented, so that additional grains and chemicals are efficiently supplied to each region of the substrate 7. Therefore, the polishing speed increases. |
