发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board where no toxic material such as cyano radical or halogen material is possible to be generated. SOLUTION: The multilayer printed wiring board comprises, at least, a substrate 1, a first circuit pattern 2a formed on the substrate 1, an insulating layer 3a so formed on the substrate 1 as to shield the first circuit pattern 2a, a non- through hole 5 so formed at the insulating layer 3a as to expose the first circuit pattern 2a, and a second circuit pattern 6 so continuously formed on the insulating layer 3a from the inside wall of the non-through hole 5a as to connect to the first circuit pattern 2a. The insulating layer 3a comprises an insulating material comprising a bisphenol A-type epoxy resin excluding a halogenated epoxy resin by 40-50 wt.%, a phenol resin by 40-52 wt.%, and a phosphorous- containing aromatic compound by 8-10 wt.%.
申请公布号 JP2002100878(A) 申请公布日期 2002.04.05
申请号 JP20000291773 申请日期 2000.09.26
申请人 VICTOR CO OF JAPAN LTD 发明人 ENOMOTO KATSUTOSHI;SEKI YASUAKI
分类号 H05K3/46;C08L63/00;H05K1/02;(IPC1-7):H05K3/46 主分类号 H05K3/46
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