| 摘要 |
A heat dissipation arrangement for chip modules on multilayer ceramic substrates, in particular multichip modules, in which passages for a heat-conducting medium are provided in the ceramic substrate. The multilayer ceramic substrate is mounted on a metal heat sink. Thermal passages, in particular in the form of a hole pattern or array, are provided in the top layer of the multilayer ceramic substrate, in the region of the chip to be mounted. A cavity functioning as an evaporation chamber is provided in the layer of the multilayer ceramic substrate directly beneath the top layer, in the region of the chip to be mounted, and a trough-shaped recess functioning as a condenser is provided in the metal heat sink, in the region of the chip to be mounted. In the layers of the multilayer ceramic substrate located between the evaporation chamber and the condenser, in the region of these two chambers, a series of large steam channels and small condensate channels, the latter functioning as capillaries is provided, which interconnect these two chambers. This arrangement forms a miniaturized heat pipe structure which can transport a great amount of energy per unit of time across short distances.
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