| 摘要 |
PROBLEM TO BE SOLVED: To process a substrate uniformly by preventing uneven processing due to supporting of the substrate when the substrate is supported by a drive member and subjected to rotary processing. SOLUTION: In the system 1 for processing a substrate, a substrate W is supported by a plurality of drive pins 12 butting against the outer circumferential edge of the substrate W on a rotary supporting plate 11 to regulate movement in the horizontal direction. A substrate holding section 10 is coupled with a rotary tubular shaft 13 connected with a diaphragm 41 through a bearing 44. When the diaphragm 41 is excited by a vibration imparting means 40 during rotary processing of the substrate W, the substrate W slips with respect to the drive pins 12 and the substrate W rotates relatively to the rotary supporting plate 11. Since the drive pins 12 do not butt against the outer circumferential edge of the substrate W continuously at the same position, uneven processing due to supporting of the substrate W is prevented and uniform processing can be ensured.
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