POLISHING APPARATUS FOR HIGH-HARDNESS WAFER

摘要

PURPOSE: A polishing apparatus for a high-hardness wafer is provided to extend a lifetime of a surface plate and to improve polishing efficiency, by changing the structure of the surface plate and by using a simple power transmission structure to prevent the surface plate from being partly worn away. CONSTITUTION: The high-hardness wafer is polished by friction with the surface plate(1) rotating with respect to a rotation axis(3) connected to a motor(2). The surface plate is so formed to protrude that a polishing part(1') in direct contact with the high-hardness wafer has a width not greater than the diameter of the high-hardness wafer. A wafer rotating apparatus rotates at least one high-hardness wafer over the polishing part. A wafer pressuring apparatus pressures the high-hardness wafer to be closely adhered to the polishing part.