发明名称 HEAT SINK DEVICE
摘要 PROBLEM TO BE SOLVED: To secure the coherency between heat generating electronic components and a heat sink, and at the same time to separate a soldering process from a heat sink assembly one in a heat sin device used for various electronic equipment. SOLUTION: A folding section 3a is provided at one end of the heat sink 3, is brought into contact with pad rubber 5 of a PWB 1, and at the same time is screwed to a spacer 7 fixed onto the PWB 1 at nearly the middle point between the heat generation electronic components 2 and the folding section 3a, thus securing the coherency between the heat generation electronic components 2 and folding section 3a for efficiently transferring heat, and at the same time assembling the heat sink 3 after the heat generation electronic components 2 are mounted onto the PWB 1 by solder.
申请公布号 JP2002094273(A) 申请公布日期 2002.03.29
申请号 JP20000277784 申请日期 2000.09.13
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ISHIDA KIYONORI;NAKAMURA KAZUO
分类号 H05K7/12;H01L23/36;H01L23/40;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/12
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