| 摘要 |
PROBLEM TO BE SOLVED: To provide a contact structure for lead easily forming a contact structure using suitable metal for each of a lead and a bump, and having the bump and the lead connected soundly electrically and in strength. SOLUTION: This contact structure of lead has a lead 12 formed by etching a conductive foil 11 and the bump 5 electrically cast by plating, the bump 5 and the lead 12 are formed of mutually different metals, the bump 5 is bound to the surface of the lead 12 through a conductive binder 10, the surface of the side, where the bump 5 is arranged, of the lead 12 is closely attached to a first major surface 15 of a hole-free insulating sheet 8, the base part of the bump 5 is forced to pass through the material of the hole-free insulating sheet, the side surface of the base part of the bump 5 is fused with the inner wall surface of the through hole 17, and the tip of the bump 5 is projected from a second major surface 16 of the insulating sheet 8. |
