ELECTRONIC CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable and inexpensive electronic apparatus which can be manufactured easily while reducing the size. SOLUTION: A resin case and a heat dissipating plate are fixed by injection molding to a terminal block including terminals 1. A highly heat conductive insulation material is fixed to the heat dissipating plate. A substrate is fixed in contact with a heating element mounted on the substrate. The substrate and the resin case are secured by means of a catching part provided on the resin case. The resin case is provided with guides at four corners thereof in order to prevent the substrate from being shifted at the time of soldering. The guides at four corners have different shapes so that the substrate is not inserted erroneously. The highly heat conductive insulator can come contact the heating element even if the substrate or a component is altered by varying the thickness of the heat dissipating plate being fixed. A highly heat conductive resin having thermal conductivity of 0.4 [W/m.h. deg.C] or above is employed in the highly heat conductive insulator. The terminals and the substrate are secured in U- shape so that incomplete soldering can be recognized easily.