发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE MATERIAL USING THE SAME
摘要 PROBLEM TO BE SOLVED: To enhance the sensitivity of a photosensitive material. SOLUTION: The photosensitive resin composition contains a compound of formula (1). A high sensitivity photosensitive material can be provided by using the photosensitive resin composition.
申请公布号 JP2002082434(A) 申请公布日期 2002.03.22
申请号 JP20000271532 申请日期 2000.09.07
申请人 HODOGAYA CHEM CO LTD 发明人 YOSHIKAWA KATSUMASA;TARUMOTO NAOHIRO;KOMATSU SHIHOKO;MIKI TETSUZO
分类号 G03F7/029;C08F2/44;C08F2/50;C08F291/06;G03F7/027;G03F7/032;H05K3/00 主分类号 G03F7/029
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