发明名称 Paste for filling throughhole and printed wiring board using same
摘要 A paste for filling a throughhole, comprises: an epoxy resin; a curing agent; and a metal filler, wherein the metal filler is a powder comprising a base metal, and the curing agent is an imidazole compound represented by the following formula (1): wherein R1 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyalkyl group having 1 to 10 carbon atoms or an alkyloxy group having 1 to 10 carbon atoms.
申请公布号 US2002033275(A1) 申请公布日期 2002.03.21
申请号 US20010904097 申请日期 2001.07.13
申请人 NGK SPARK PLUG CO., LTD. 发明人 SUMI HIROSHI;KOJIMA TOSHIHUMI
分类号 H05K1/09;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/09
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