PHOTORESIST REMOVER COMPOSITION

摘要

The present invention is a photoresist remover composition used in order to remove photoresist during the manufacturing process of semiconductor devices, such as large-scale integrated circuits and very large-scale integrated circuits. The present invention comprises 2∼20 weight % of water-soluble hydroxylamine, 5∼15 weight % of oxime compound, 10∼45 % of water, 4∼15 weight % of organic phenol compound containing 2 or 3 hydroxyl groups, and 30∼55 weight % of alkyl amide.