Method of manufacturing mounted AFM-probes by soldering

摘要

An optimised soldering procedure is disclosed, demonstrating its use for mounting of a probe to a holder chip. In a preferred embodiment a metallisation system of Ti:W+Ni+Au is applied with a SnBi58 solder paste in combination with a hotplate for the soldering step. The soldered probes are highly conductive and the mechanical connection between probe and holder chip is very rigid. The probe - holder chip assembly shows clear resonance peaks in tapping mode AFM.