| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-film capacitor capable of preventing diffusion of Au from an upper electrode layer in a solder bump by a simple method at a low cost. SOLUTION: The thin-film capacitor comprises a lower electrode layer 2 formed on a board 1, a dielectric thin film 3 formed on the layer 2, an upper electrode layer 4 made of Au formed on the film 3, a diffusion preventing layer 5 made of one among Ni, Ni-Cu alloy, Ni-Cr alloy or a surface Ni-plated Ti formed on the layer 4, and a solder bump 7 formed on the layer 5.
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