| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of the drop of the mechanical strength of a ceramic circuit board due to fine partial cracks which occur in a ceramic substrate when signal terminals are formed on a metallic circuit board. SOLUTION: The ceramic circuit board is constituted by bonding the metallic circuit board 3 to at least the portion of the upper surface of the ceramic substrate 1 faced to a splitting groove 2 formed on the lower surface of the substrate 1, and a metallic sheet 4 to the lower surface of the substrate 1 so that the sheet 4 will not lie on the groove 2 with a brazing material 5. In addition, a non-bonded section 6 having an area of five times as large as the thickness of the metallic circuit board 3 on both side of the splitting groove 2 is formed at the portion facing the groove 2 between the substrate 1 and the circuit board 3. Since the substrate 1 can be split well from the splitting groove 2 and, at the same time, the signal terminals can be formed by bending the metallic circuit board 3 upward, no crack occurs in substrate 1.
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