发明名称 COATED COPPER POWDER
摘要 PROBLEM TO BE SOLVED: To provide coated copper powder enabling to obtain stable conductivity by addition of small amount, excellent in heat resistance and suitable for an electromagnetic shield and conductive paste. SOLUTION: Coated copper powder is comprised of copper particles and coated copper particles having a nickel alloy layer cladding the copper particles, containing phosphorus and/or boron as an alloying element and additionally including cobalt and/or tungsten according to requirements, and a silver layer coating the nickel alloy layer.
申请公布号 JP2002075057(A) 申请公布日期 2002.03.15
申请号 JP20000260964 申请日期 2000.08.30
申请人 MITSUI MINING & SMELTING CO LTD 发明人 SAKAGAMI TAKAHIKO;SAKAGAMI HISAARI;HAYASHI HISAO;SHIMAMURA HIROYUKI
分类号 B22F1/00;B22F1/02;C22C19/03;C23C28/02;H01B1/22;H01B5/00;H05K9/00;(IPC1-7):H01B5/00 主分类号 B22F1/00
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