BONDING METHOD OF SMALL PARTS AND MODULE OF COMBINED SMALL PARTS

摘要

A groove (3) having a V-shaped section is provided on a bonding surface (1a) of an IC chip (1) being as a first small part, while an elongate projection (4) having a V-shaped section to engage with the groove (3) of the first IC chip (1) is provided on a corresponding portion of a bonding surface (2a) of an IC chip (2) being as a second small part (2). Then, the IC chips (1, 2) are bonded together by the action of a holding force resulting from fitting the elongate protection (4) of the second IC chip to the groove (3) of the first IC chip (1), together with a bonding force produced between the bonding surfaces by interatomic force and metallic bond.