发明名称 METHOD OF SUPPRESSING CURE OF MOISTURE CURABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a method of suppressing cure of a moisture curable composition which cures at room temperature by coming in contact with moisture in air, in order to solve various problems occurring at the location for moisture to intrude in a production line or an automated coater line or the like, for example, an abrasion of packing at the sliding joint. SOLUTION: The method of suppressing cure of a moisture curable composition having a polymer containing hydrolyzable silyl group as the reactive component comprises bringing a compound having three or more hydroxy groups (-OH) in a molecule into contact with the surface of the part where moisture is apt to come into contact by intrusion beforehand the composition cures by moisture.
申请公布号 JP2002069194(A) 申请公布日期 2002.03.08
申请号 JP20000255938 申请日期 2000.08.25
申请人 SEKISUI CHEM CO LTD 发明人 YAMAUCHI YASUSHI
分类号 C08J3/00;C08L71/02;C09J183/04;C09K3/10;(IPC1-7):C08J3/00 主分类号 C08J3/00
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