发明名称 SPUTTERING TARGET AND SPUTTERING APPARATUS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To suppress spalling and falling of re-coated material from a non- erosion part of the body of a target or a packing plate, whereby the generation of dust brought above by the spalling and falling of re-coated material, is diminished, and further, the generation of dust brought about by splash phenomena, and the like, is diminished. SOLUTION: A sputtering target 3 is equipped with the body of the target 1 and the packing plate 2 sputtering the body of the target 1. The non-erosion part of the body of the target 1 is provided with a surface-treatment area 6 prepared by etching treatment or polishing treatment. This surface-treatment area 6 displays an effect (the above suppression) even if being prepared on an erosion part, and further even if being formed on the exposed surface of the packing plate.
申请公布号 JP2002069627(A) 申请公布日期 2002.03.08
申请号 JP20000261375 申请日期 2000.08.30
申请人 TOSHIBA CORP;TOSHIBA ELECTRONIC ENGINEERING CORP 发明人 ISHIGAMI TAKASHI;YABE YOICHIRO;KOSAKA YASUO;WATANABE KOICHI;WATANABE TAKASHI;SUZUKI YUKINOBU;FUJIOKA NAOMI;NAKAMURA TAKASHI;KOMATSU TORU
分类号 C23C14/34;C23C14/00;H01L21/203;(IPC1-7):C23C14/34 主分类号 C23C14/34
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