Housing for surface mounted device (SMD) component, has heat slug joined to molded body for supply and removal of heat

摘要

A housing for an SMD component has a molded body (1) for accommodating the component (2) and a 'heat slug' (3) joined to the molded body for supplying and removing of thermal energy for melting the solder paste (4). The housing has flow devices which are specifically formed by chamfers/tapers (11) of the molded body and/or of the 'heat slug' (3).