APPARATUS FOR UNIFORMLY PLATING SUBSTRATE

摘要

PURPOSE: An apparatus for uniformly plating a substrate is provided which prevents plating defects inside via holes by installing a fixing frame for fixing the substrate so that the frame is ascended or descended and vibrated, and installing an ultrasonic oscillator on the inner side of a plating vessel into which the substrate is submersed. CONSTITUTION: The apparatus for uniformly plating a substrate comprises a fixing frame(100) to which a plurality of substrates(110) are fixed, and from both sides of which rotation axes are projected; a substrate fluctuation part in which rotation plates fixed through motors(240) and fixing axes(220) are installed at a supporter(210) to the lower parts of which ascent and descent cylinders(260) are connected so that the rotation axes are eccentrically connected to the rotation plates, and an oscillator(270) installed on the supporter is elastically connected to the upper side of the fixing frame(100); and a plating vessel(300) in which the fixing frame(100) is inserted, and an ultrasonic oscillator(320) is installed at the inner side of the plating vessel(300) in which a plating solution is filled, wherein the ultrasonic oscillator(320) installed in the plating vessel(300) is a round type.