Wärmeabführendes Bauteil und damit versehene Halbleitervorrichtung

摘要

Disclosed herein is a semiconductor laser provided with a heat radiating component which is improved in heat radiating property. The semiconductor laser comprises a heat radiating component for radiating heat which is generated in operation. In this heat radiating component, a polycrystalline diamond layer (3) synthesized by vapor deposition is formed on the upper surface of a stem (4). A semiconductor laser element (1) is brazed/bonded onto the surface of the vapor-deposited polycrystalline diamond layer (3) through a brazing filler metal (2). Also disclosed herein is a heat radiating component having a thermal expansion coefficient being coincident to that of an LSI chip to be mounted thereon, which is excellent in heat radiating property.