Production of substrates used for electronic circuits comprises electroplating copper layers on a support and processing to leave circuit lines

摘要

Production of substrates comprises: (i) electroplating a thin copper layer on a polyimide layer (21) as support; (ii) electroplating a thick copper layer (23) on the thin layer; (iii) applying a first light-sensitive protective layer on the upper side of the support and second light-sensitive protective layer on the lower side of the support; (iv) applying masks on both sides and illuminating the support; (v) developing the support to remove the protective layers; (vi) electroplating a further copper layer (27) on the upper side of the support; (vii) etching the lower side of the support; (viii) illuminating the further copper layer; and (ix) rinsing the protective layers with a chemical agent; and (x) removing excess copper layer to leave circuit lines (3).