| 摘要 |
PURPOSE: A lead conditioning system is provided to completely cope with defective appearances of a semiconductor lead, by adding a lead open part for repairing a length defect of the lead to a repair part for repairing defective appearances of the lead so that the length defect can be repaired in the repair part. CONSTITUTION: The repair part is composed of the lead open part, a TiN-bur part, a skew part and a coplanarity part. The lead open part repairs the length defect of the lead. The TiN-bur part eliminates the particle of the lead. The skew part repairs a right/left position defect of the lead. The coplanarity part repairs an upper/lower position defect of the leads.
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