| 摘要 |
PROBLEM TO BE SOLVED: To enable unmanned processing of a series of operations from releasing a wafer after being polished from a wafer bonded plate to loading the wafer into a wafer accommodating carrier. SOLUTION: The apparatus includes a plate transfer roller 2, a plate transfer device 3 having four divisions of a plate acceptance stage 3a, a wafer positioning stage 3b, a wafer releasing stage 3c and a plate discharging stage 3d, a laser displacement meter 7 for detecting a wafer bonded position, a wafer releasing robot 4, a wafer transfer mechanism 5 for transferring wafer 10 released from a wafer bonded plate 1 to a carrier loader 6 for wafer accommodation, and a plate discharging roller 11 for transferring the plate 1 having the wafer 10 released therefrom outside of the apparatus. |
