| 摘要 |
A wiring board for high dense mounting comprises at least one layer of interlayer insulator and at least one layer of conductive wiring pattern formed on a base material. The interlayer insulator comprises a polybenzoxazole film. An adhesive layer comprising at least one selected from the group consisting of Ti, Ti-containing compounds and Ni is formed between the polybenzoxazole film and the conductive wiring pattern. The wiring board has a high heat resistance, low dielectric constant, low water absorption degree, low thermal expansion coefficient, and high adhesion between conductors and insulators. The wiring board is also excellent in film strength and shear extensibility, capable of enduring a stress in mounting of a semiconductor device, excellent in reliability, and optimal for high speed and high dense mounting.
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