SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To miniaturize an element without changing a manufacturing pattern, maintain performance and enable manufacturing at a low cost. SOLUTION: In a semiconductor device, a semiconductor layer 2 is formed on an insulating film 1, and an arbitrary number of semiconductor elements are formed on the semiconductor layer 2. The semiconductor layer is provided with an element region 3 for forming the semiconductor elements and potential leading-out regions 4a, 4b as thin semiconductor films which are collectively formed in self-alignment manner to the element region 3 and thinner than the element region.