发明名称 CEILING BOARD
摘要 PROBLEM TO BE SOLVED: To develop a ceiling board with excellent heat insulating property. SOLUTION: This ceiling board is formed in flat cylindrical shape, and the interior is formed as a tubular cavity part extending along a lengthwise direction. The cavity part is filled with air, and since air is a heat insulating material of good quality, heat transfer between the surface and back face of the ceiling board is suppressed. The ceiling board itself therefore has heat insulating performance. The ceiling board of such shape can be easily manufactured at a low cost by extrusion-molding plastic.
申请公布号 JP2002061327(A) 申请公布日期 2002.02.28
申请号 JP20000249393 申请日期 2000.08.21
申请人 SOKEN:KK 发明人 TANAKA TETSUYA
分类号 E04B9/04;E04C2/30 主分类号 E04B9/04
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