| 摘要 |
PROBLEM TO BE SOLVED: To prevent the leakage of the vapor of a resist stripper when a semiconductor substrate is carried in and out of a treating vessel, to reduce the contamination of the resist stripper and, in addition, to improve the performance of a resist stripping system. SOLUTION: After the stripping-off treatment on a resist film formed on the semiconductor substrate 2 ends in the treating vessel 1, a second opening/ closing lid 4 is closed and the vapor of the resist stripper left in a first area 11 is discharged to the outside of the vessel 1 through a first discharge pipe 7. Then the substrate 2 is carried out of the vessel 1 through a substrate carrying-in port 13 by opening a first opening/closing lid 3. During the stripping- off treatment, the used resist stripper dropping from the substrate 2 is recovered in a recovering pan 8 and disposed to the outside of the vessel 1 through a pipe 81. |
