发明名称 |
Semiconductor device, designing method and designing device thereof |
摘要 |
A semiconductor device is provided with dummy patterns at an originally thinner portion of each of layers, and each of these dummy patterns is electrically connected to a reference wire that is either a power-supply wire or a ground wire.
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申请公布号 |
US2002024148(A1) |
申请公布日期 |
2002.02.28 |
申请号 |
US20010891356 |
申请日期 |
2001.06.27 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
ITOH NIICHI |
分类号 |
G06F17/50;H01L21/3205;H01L21/82;H01L21/822;H01L23/52;H01L23/528;H01L23/544;H01L27/02;H01L27/04;(IPC1-7):H01L23/48;H01L29/40 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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