发明名称 Compositions with enhanced ductility
摘要 The invention relates to compositions comprising an organoclay and polyphenylene ether resin and blends containing polyphenylene ether resin. In a preferred embodiment, the compositions exhibit physical properties that are enhanced over compositions containing clay of the prior art. The invention also relates to methods to enhance the ductility of thermoplastic compositions as compared to compositions containing clay of the prior art. The invention also relates to articles made from the compositions.
申请公布号 US6350804(B2) 申请公布日期 2002.02.26
申请号 US19990291462 申请日期 1999.04.14
申请人 GENERAL ELECTRIC CO. 发明人 ADEDEJI ADEYINKA;CAMPBELL JOHN R.;KHOURI FARID FOUAD;RODGERS PATRICK A.
分类号 C08J5/00;C08K5/00;C08K9/04;C08L71/12;C08L77/00;(IPC1-7):C08K3/34 主分类号 C08J5/00
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