发明名称 |
Abrasive pad for cmp |
摘要 |
An abrasive pad for CMP has a substrate and an abrasive layer disposed on the substrate. An abrasive pad for CMP having a substrate and an abrasive layer disposed on the substrate, wherein said abrasive layer has a three-dimensional structure including a plurality of regularly arranged three-dimensional elements having a predetermined shape, and said abrasive layer comprises an abrasive composite containing advanced alumina abrasive grains produced by a CVD method and a binder as construction components. |
申请公布号 |
AU8323501(A) |
申请公布日期 |
2002.02.25 |
申请号 |
AU20010083235 |
申请日期 |
2001.08.09 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
TAKASHI AMANO;TOSHIHIKO WATASE;KENGO IMAMURA |
分类号 |
B24B37/20;B24B37/22;B24B37/24;B24D3/00;B24D3/28;B24D13/14;C08J5/14;C08K7/00;C08L101/00;C09K3/14;H01L21/304 |
主分类号 |
B24B37/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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