| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an area array type semiconductor package which can be applied to higher density mountings. SOLUTION: In the area array type semiconductor package, after forming on at least one surface of a support member 2 made of an insulating material wirings made of a conductive material, a semiconductor element 1 is so mounted on this surface to form on the side of the other surface of the support member 2 electrodes 4 arranged into a form of an area array. Further, in the semiconductor package, protruding portions 9 are provided respectively on the electrodes 4, and the surface of each protruding portion is made of materials such that at least a soldering material can be jointed to the surface by fusing the material and the soldering material body by making them into an alloy.</p> |
