| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic assembly with a high-density interconnection. SOLUTION: With the electronic assembly with an electronic module 1 provided with an optical interconnection means and a heat-discharge means 3, 12, the heat-exhausting means is equipped with a base plate 7 exclusive for heat exhaustion to which the module is fitted. The interconnection means has nothing to do with the base plate, and preferably, is equipped with a printed circuit 35 and an optical fiber 34 included in the circuit. The optical fiber has a tip part 36 arranged so as to exactly face an optical contact point 32 of the module, by fitting a BGA type printed circuit on the module. The fitting of the BGA type consists of exactly arranging a sphere 37 on the module, on one hand, and of arranging metal regions 38 on the circuit, and further, of arranging the sphere face to face with these regions so that the sphere is automatically centered by capillary phenomenon with these regions.</p> |
