| 摘要 |
PROBLEM TO BE SOLVED: To automatically create the application pattern for resin for masking that is optimum to a printed circuit board. SOLUTION: The resin application-control deice includes a packaging information file 21, packaging element definition files 22 and 23 where size information is defined to a packaging element with a nonspecified size to the packaging information file, an application part information file 25 where performance data for each nozzle is defined, a means 24 for specifying the kind of the packaging element where the resin is applied, and a data-processing device 11. The data-processing device selectively utilizes each file information and the kind information of the packaging element to be coated by resin, for automatically determining a resin application pattern consisting of a plurality of resin application regions in the X and Y directions.
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