| 摘要 |
<p>The invention relates to a method for mounting at least one electric component (110) on a support (1) by using solder (100), according to which elevations are placed in the solder support, whereby the elevations are at least as high as the thickness of a solder layer to be provided. In another step, the solder, especially a solder foil, is placed on the elevations, and in another step, the elevations are pressed down until they are approximately at the height of the solder thereby enabling a subsequent soldering process to ensue. The method serves to provide precisely defined solder layer thicknesses with tolerances of less than 10 micrometers.</p> |
