| 发明名称 |
PLATING METHOD AND APPARATUS THAT CREATES A DIFFERENTIAL BETWEEN ADDITIVE DISPOSED ON A TOP SURFACE AND A CAVITY SURFACE OF A WORKPIECE USING AN EXTERNAL INFLUENCE |
| 摘要 |
The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion. |
| 申请公布号 |
WO0215245(A2) |
申请公布日期 |
2002.02.21 |
| 申请号 |
WO2001US24890 |
申请日期 |
2001.08.09 |
| 申请人 |
NUTOOL, INC.;BASOL, BULENT |
发明人 |
BASOL, BULENT |
| 分类号 |
C25D5/02;C25D5/08;C25D5/18;C25D5/22;C25D5/34;C25D7/12;H01L21/288;H01L21/3205;H01L21/768;H01L23/12 |
主分类号 |
C25D5/02 |
| 代理机构 |
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代理人 |
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