A transmitter and receiver module comprises individual packages, each containing some of electronic parts for millimeter or submillimeter wave transmission and reception; and an overall enclosure containing all the parts, including the individual packages. The packages each contain two or more electronic parts associated with one other, and each package can be tested independently. Either the packages or the enclosure or both are hermetically sealed. Such a transmitter and receiver module can be manufactured at low cost and tested quickly with reliability.
