发明名称 |
Printed wiring board, and method and apparatus for manufacturing the same |
摘要 |
In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.
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申请公布号 |
US2002020557(A1) |
申请公布日期 |
2002.02.21 |
申请号 |
US20010976376 |
申请日期 |
2001.10.12 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NISHII TOSHIHIRO;YAMANE SHIGERU;NAKAMURA SHINJI;HAYASHI HIDENORI;FUJIMOTO TORU;OKADA TOSHIHARU;NAKAI IZURU |
分类号 |
H05K1/03;H05K3/00;H05K3/40;(IPC1-7):H05K1/11 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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