| 发明名称 |
Polyimide etching solution and etching process |
| 摘要 |
<p>A resin etching solution comprises a hydroxyalkylamine, an alkali metal compound and water, or an aliphatic alcohol, an aliphatic amine, an alkali metal compound and water, and a process for etching a polyimide film comprises forming a resist pattern or metal layer pattern using the resin etching solution.</p> |
| 申请公布号 |
EP0832918(B1) |
申请公布日期 |
2002.02.20 |
| 申请号 |
EP19970307359 |
申请日期 |
1997.09.22 |
| 申请人 |
TORAY ENGINEERING CO., LTD. |
发明人 |
SUZUKI, ATSUSHI;AIMOTO, MAYUMI;KUBOTA, TAKASHI;AKITA, MASANORI;ITOH, KOJI |
| 分类号 |
C08J7/12;C09K13/02;H05K1/03;H05K3/00;(IPC1-7):C08J7/12 |
主分类号 |
C08J7/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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