| 摘要 |
PROBLEM TO BE SOLVED: To obtain a ceramic sintered compact which can be sintered together with low-resistance metal such as silver, copper and gold, above all with silver and is high in thermal conductivity and strength and low in dielectric constant. SOLUTION: The wiring board is provided with an insulated board 1 and a wired circuit layer 2 disposed on the surface and/or the inside of the board 1. The board 1 is formed from the ceramic sintered compact which contains at least a glass phase, a crystal phase of a spinel-based compound such as gahnite (ZnAl2O4) and/or spinel (MgAl2O4) and a crystal phase (N) of at least one non-oxide compound selected from the group consisting of AlN, Si3N4, SiC and BN and has >=95% relative density <=8 dielectric constant and >=2 W/m.K thermal conductivity. |
