发明名称 Electroplating process for preparing a Ni layer of biaxial texture
摘要 Disclosed is an Ni-plated layer of biaxial texture, which is formed by electroplating. In the Ni-plated layer,peaks measured on a theta-rocking curve have a FWHM of 7° or less in terms of the misorientation on the c-axis; and peaks measured on phi-scan have a FWHM of 21° or less in terms of the misorientation on the plane formed by the a-axis and the b-axis. Also, a process of electroplating a Ni layer are disclosed. The process comprises forming a Ni-plated layer of biaxial texture under a magnetic field by electroplating and subjecting the Ni-plated layer to thermal treatment to develop the biaxial texture. This electroplating process is expected to give a significant contribution to the development of the electroplating technology and to replace the vacuum deposition used for the preparation of thin film magnetic materials or thin film piezoelectric materials.
申请公布号 US6346181(B1) 申请公布日期 2002.02.12
申请号 US20000571821 申请日期 2000.05.16
申请人 KOREA INSTITUTE OF MACHINERY AND MATERIALS 发明人 LEE KYU HWAN;CHUNG HYUNG-SIK;LEE SANG RO;CHANG DOYON;JEONG YONGSOO;YOO JAIMOO;KO JAE-WOONG;KIM HAI-DOO
分类号 C25D3/12;C25D5/00;C25D5/18;(IPC1-7):C25D5/00 主分类号 C25D3/12
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