| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC package substrate with excellent heat resistance, low thermal expansion, excellent flame resistance without using a halogen flame retardant. SOLUTION: The epoxy resin composition for a copper-clad laminate has as essential components (A) an epoxy resin having 3 or more epoxy groups in a molecule, (B) a curing agent of phenol resin having 3 or more phenolic hydroxyl groups in a molecule, (C) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10- oxide and (D) a spherical fused silica having the maximum diameter of 24μm, the average diameter of 2-5μm and the specific surface area of 5 square m/g or below. The component (A) is preferably at least one of epoxy resins selected from an epoxy resin of trishydroxyphenylmethane type, an epoxy resin of tetrakishydroxyphenylethane type and novolak type epoxy resin.
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