发明名称 CONNECTING STRUCTURE, CONNECTING METHOD, IC CARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a connecting structure, a connecting method, an IC card and its manufacturing method that can form a circuit of low resistance and that are excellent in reliability of connection. SOLUTION: A connecting structure is comprised of a circuit made of conductive paste and electronic parts. A connecting method is comprised of formation of the circuit by the conductive paste, overlap of the electronic parts, heating and pressurizing. An IC card is comprised of the circuit made of the conductive paste, the electronic parts and a cover film. A method for manufacturing the IC card is formation of the circuit made of the conductive paste, overlap of the electronic parts on it, overlap of a cover film on them, heating and pressurizing.
申请公布号 JP2002043716(A) 申请公布日期 2002.02.08
申请号 JP20000230192 申请日期 2000.07.31
申请人 HITACHI CHEM CO LTD 发明人 SHIBUYA MASAHITO;ISHIZAKA HIRONOBU;KISE YOSHITAKA
分类号 B42D15/10;G06K19/07;G06K19/077;H05K1/02;H05K1/18 主分类号 B42D15/10
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