CONDUCTIVE BONDING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide new conductive bonding material which is preferably used for bonding a wiring pattern and an electronic part together as bonding pattern material in a process for mounting electronic parts. SOLUTION: A particle 10 is used as the conductive bonding material for bonding the wiring pattern formed on a substrate and the electronic part together in the process for mounting electronic parts. The particle 10 includes high melting point metal powder 1, a charge control agent 2, and a resin component 3.