JIG FOR HEAT TREATING SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a jig for heat treating semiconductor wafer and a method for manufacturing the same causing no crystal defect such as slip on the semiconductor wafer under high temperature heat treatment. SOLUTION: The jig for heat treating a semiconductor wafer and the method for manufacturing the same comprises a wafer holding member formed capable of holding the semiconductor wafer, and a holding surface built on the wafer holding member for contacting and holding the semiconductor wafer with powder of heat-resistant high purity materials adhering on the same.