Heat conductive silicone composition and semiconductor device

摘要

A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having at least two Si-H groups, (C) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (D) an organosilane having a long-chain alkyl groups, (E) platinum or a platinum compound, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.