| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging structure of a housing to a circuit board preventing the sticking of solder particles to an opening in a hollow part of the housing in a soldering process. SOLUTION: This packaging structure is composed of the housing 1 made of synthetic resin; a rotating shaft 7 rotatably supported to the housing 1 and exposing one end from the housing 1; the circuit board 21 directly or indirectly fixing the housing; and a bearing part 10 receiving the other end of the rotating shaft 7, projecting to the housing 1, and exposed from the circuit board 21. The hollow part 25 opening in the shaft direction is installed in the bearing part 10, and a cutout 30 which is a communication part communicating with the hollow part 25 is installed on the side surface of the hollow part 25.
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